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NTHD3102C
Power MOSFET
Complementary, 20 V, +5.5 A /?4.2 A,
ChipFET t
Features
?
?
?
?
?
?
Complementary N?Channel and P?Channel MOSFET
Small Size, 40% Smaller than TSOP?6 Package
Leadless SMD Package Provides Great Thermal Characteristics
Leading Edge Trench Technology for Low On Resistance
Reduced Gate Charge to Improve Switching Response
This is a Pb?Free Device
V (BR)DSS
N?Channel
20 V
http://onsemi.com
R DS(on) TYP
29 m W @ 4.5 V
37 m W @ 2.5 V
I D MAX
(Note 1)
5.5 A
Applications
48 m W @ 1.8 V
?
?
?
?
DC?DC Conversion Circuits
Load/Power Switching
Single or Dual Cell Li?Ion Battery Supplied Devices
Ideal for Power Management Applications in Portable, Battery
Powered Products
P?Channel
?20 V
D 1
64 m W @ 4.5 V
83 m W @ 2.5 V
105 m W @ 1.8 V
?4.2 A
S2
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Parameter
Drain?to?Source Voltage
Symbol
V DSS
Value
20
Unit
V
G 1
G 2
Gate?to?Source Voltage
N?Ch
V GS
" 8.0
V
S 1
D 2
P?Ch
" 8.0
N?Channel MOSFET
P?Channel MOSFET
N?Channel
Continuous Drain
Current (Note 1)
Steady
State
T A = 25 ° C
T A = 85 ° C
I D
4.0
2.9
A
ChipFET
CASE 1206A
t ≤ 5s
T A = 25 ° C
5.5
STYLE 2
P?Channel
Continuous Drain
Current (Note 1)
Steady
State
T A = 25 ° C
T A = 85 ° C
I D
3.1
2.2
A
PIN CONNECTIONS
MARKING
DIAGRAM
t ≤ 5s
T A = 25 ° C
4.2
Power Dissipation
(Note 1)
Steady
State
T A = 25 ° C
P D
1.1
W
D 1
8
1
S 1
1
8
t ≤ 5s
2.1
D 1
7
2
G 1
2
7
Gate?to?Source ESD Rating ?
ESD
100
V
D 2
6
3
S 2
3
6
(Human Body Model, Method 3015)
Stresses exceeding Maximum Ratings may damage the device. Maximum
D 2
5
4
G 2
4
5
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
(Bottom View)
(Top View)
Recommended Operating Conditions may affect device reliability.
1. Surface?mounted on FR4 board using 1 in sq pad size
(Cu. area = 1.127 in sq [1 oz] including traces).
D6 = Specific Device Code
M = Date Code
G = Pb?Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
? Semiconductor Components Industries, LLC, 2006
September, 2006 ? Rev. 2
1
Publication Order Number:
NTHD3102C/D
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